Display device

ABSTRACT

A non-breakable display device, electronic appliance, or lighting device is provided. A bendable display device in which a first flexible substrate and a second flexible substrate provided with transistors overlap each other with a bonding layer therebetween is fabricated. The display device is bent so that the first substrate is positioned on the inner side (the valley side) and the second substrate is positioned on the outer side (the mountain side).

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an object, a method, or a manufacturingmethod. The present invention relates to a process, a machine,manufacture, or a composition of matter. In particular, one embodimentof the present invention relates to a light-emitting device, a displaydevice, an electronic appliance, a lighting device, a fabrication methodthereof, usage thereof, or an operation method thereof. In particular,one embodiment of the present invention relates to a light-emittingdevice, a display device, an electronic appliance, or a lighting devicethat utilizes electroluminescence (EL), a fabrication method thereof,usage thereof, or an operation method thereof.

2. Description of the Related Art

Recent light-emitting devices and display devices are expected to beused for a variety of purposes and become diversified.

For example, light-emitting devices and display devices for mobiledevices and the like are required to be thin, lightweight, andnon-breakable.

Light-emitting elements utilizing EL (also referred to as EL elements)have features such as ease of thinning and lightening, high-speedresponse to input signal, and driving with a direct-current low voltagesource; therefore, application of the light-emitting elements tolight-emitting devices and display devices has been proposed.

For example, Patent Document 1 discloses a flexible active matrixdisplay device in which an organic EL element or a transistor serving asa switching element is provided over a film substrate.

REFERENCE

-   Patent Document 1: Japanese Published Patent Application No.    2003-174153

SUMMARY OF THE INVENTION

An object of one embodiment of the present invention is to provide ahighly portable display device, electronic appliance, or lightingdevice.

Another object of one embodiment of the present invention is to providea highly reliable display device, electronic appliance, or lightingdevice.

Another object of one embodiment of the present invention is to providea non-breakable display device, electronic appliance, or lightingdevice.

Another object of one embodiment of the present invention is to providea low-power-consumption display device, electronic appliance, orlighting device.

Another object of one embodiment of the present invention is to providea novel display device, electronic appliance, or lighting device.

A bendable display device in which a first flexible substrate and asecond flexible substrate provided with transistors overlap each otherwith a bonding layer therebetween is fabricated. The display device isbent so that the second substrate is positioned on the outer side (themountain side) in a bend portion. In other words, the display device isbent so that the first substrate is positioned on the inner side (thevalley side) in the bend portion.

One embodiment of the present invention is a display device thatincludes a first substrate and a second substrate provided withtransistors. The first substrate and the second substrate overlap eachother with a bonding layer therebetween. The display device includes abend portion where the first substrate is positioned on the inner sideand the second substrate is positioned on the outer side.

Another embodiment of the present invention is a display device thatincludes a first substrate and a second substrate provided withtransistors. The first substrate and the second substrate overlap eachother with a bonding layer therebetween. The display device includes aplurality of bend portions where the first substrate is positioned onthe inner side and the second substrate is positioned on the outer side.

Another embodiment of the present invention is a bendable display devicethat includes a first substrate and a second substrate provided withtransistors. The bendable display device is bent so that the firstsubstrate is positioned on the inner side and the second substrate ispositioned on the outer side in a bend portion.

A flexible substrate is used as the first substrate. A flexiblesubstrate is used as the second substrate. With such substrates, anon-breakable display device can be provided. Alternatively, alightweight display device can be provided. Alternatively, an easilybendable display device can be provided.

Wirings for supplying signals to the transistors are formed over thesecond substrate provided with the transistors and the like. Inaddition, a plurality of insulating layers are formed. Note that thewirings for supplying signals to the transistors are preferably formedin a grid pattern. The second substrate provided with the wirings, theinsulating layers, and the like has higher mechanical strength than thefirst substrate.

Thus, when the display device is bent so that the second substrate ispositioned on the outer side (mountain side) in the bend portion, sothat the display device is less likely to be broken even when repeatedlybent and extended. This results in improved reliability of the displaydevice.

In one embodiment of the present invention, a highly portable displaydevice, electronic appliance, or lighting device can be provided.

In one embodiment of the present invention, a highly reliable displaydevice, electronic appliance, or lighting device can be provided.

In one embodiment of the present invention, a non-breakable displaydevice, electronic appliance, or lighting device can be provided.

In one embodiment of the present invention, a low-power-consumptiondisplay device, electronic appliance, or lighting device can beprovided.

In one embodiment of the present invention, a novel display device,electronic appliance, or lighting device can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B illustrate one mode of a display device.

FIGS. 2A to 2C are a block diagram and circuit diagrams illustratingmodes of display devices.

FIGS. 3A to 3C illustrate examples of states in which a display deviceis bent.

FIGS. 4A to 4D are cross-sectional views illustrating an example of amethod for fabricating a display device.

FIGS. 5A to 5D are cross-sectional views illustrating an example of amethod for fabricating a display device.

FIGS. 6A and 6B are cross-sectional views illustrating an example of amethod for fabricating a display device.

FIGS. 7A and 7B are cross-sectional views illustrating an example of amethod for fabricating a display device.

FIGS. 8A and 8B are cross-sectional views illustrating an example of amethod for fabricating a display device.

FIGS. 9A and 9B are cross-sectional views illustrating an example of amethod for fabricating a display device.

FIGS. 10A to 10D are cross-sectional views illustrating an example of amethod for fabricating a display device.

FIG. 11 illustrates one mode of a display device.

FIGS. 12A and 12B illustrate structure examples of light-emittingelements.

FIGS. 13A to 13D illustrate examples of electronic appliances andlighting devices.

FIGS. 14A and 14B illustrate an example of an electronic appliance.

FIGS. 15A and 15B each illustrate one mode of a display device.

FIGS. 16A and 16B each illustrate one mode of a display device.

FIGS. 17A and 17B each illustrate one mode of a display device.

FIGS. 18A and 18B each illustrate one mode of a display device.

FIGS. 19A and 19B illustrate examples of cross sections of states inwhich a display device is bent.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments will be described in detail with reference to theaccompanying drawings. Note that the present invention is not limited tothe description below, and it is easily understood by those skilled inthe art that various changes and modifications can be made withoutdeparting from the spirit and scope of the present invention. Therefore,the invention should not be construed as being limited to thedescription in the following embodiments. Note that in the structures ofthe invention described below, the same portions or portions havingsimilar functions are denoted by the same reference numerals indifferent drawings, and description of such portions is not repeated.

Note that in each drawing referred to in this specification, the size ofeach component or the thickness of each layer might be exaggerated or aregion might be omitted for clarity of the invention. Therefore, thescale of each component is not necessarily limited to that illustratedin the drawing. Especially in a top view or a perspective view, somecomponents might not be illustrated for easy understanding.

The position, size, range, and the like of each component illustrated inthe drawings and the like are not accurately represented in some casesto facilitate understanding of the invention. Therefore, the disclosedinvention is not necessarily limited to the position, the size, therange, or the like disclosed in the drawings and the like. For example,in the actual fabrication process, a resist mask or the like might beunintentionally reduced in size by treatment such as etching, which isnot illustrated in some cases for easy understanding.

Note that ordinal numbers such as “first” and “second” in thisspecification and the like are used in order to avoid confusion amongcomponents and do not denote the priority or the order such as the orderof steps or the stacking order. A term without an ordinal number in thisspecification and the like might be provided with an ordinal number in aclaim in order to avoid confusion among component.

In this specification and the like, the term “electrode” or “wiring”does not limit a function of a component. For example, an “electrode” isused as part of a “wiring” in some cases, and vice versa. In addition,the term “electrode” or “wiring” can also mean a combination of aplurality of “electrodes” and “wirings” formed in an integrated manner.

Note that the term “over” or “under” in this specification and the likedoes not necessarily mean that a component is placed “directly on” or“directly below” and “directly in contact with” another component. Forexample, the expression “electrode B over insulating layer A” does notnecessarily mean that the electrode B is on and in direct contact withthe insulating layer A and can mean the case where another component isprovided between the insulating layer A and the electrode B.

Functions of a source and a drain might be switched depending onoperation conditions, e.g., when a transistor having a differentpolarity is employed or a direction of current flow is changed incircuit operation. Thus, the terms “source” and “drain” can be switchedin this specification.

In this specification and the like, the term “electrically connected”includes the case where components are connected through an objecthaving any electric function. There is no particular limitation on an“object having any electric function” as long as electric signals can betransmitted and received between components that are connected throughthe object. Thus, even when the expression “electrically connected” isused in this specification, there is a case in which no physicalconnection is made and a wiring is just extended in an actual circuit.

In this specification, the term “parallel” indicates that the angleformed between two straight lines is greater than or equal to −10° andless than or equal to 10°, and accordingly also includes the case wherethe angle is greater than or equal to −5° and less than or equal to 50.In addition, the term “perpendicular” indicates that the angle formedbetween two straight lines is greater than or equal to 80° and less thanor equal to 1000, and accordingly also includes the case where the angleis greater than or equal to 85° and less than or equal to 95°.

In this specification, in the case where an etching step is performedafter a photolithography process, a resist mask formed in thephotolithography process is removed after the etching step, unlessotherwise specified.

Embodiment 1

A structure example of a display device 100 of one embodiment of thepresent invention is described with reference to FIGS. 1A and 1B. FIG.1A is a top perspective view of the display device 100 and FIG. 1B is across-sectional view taken along the dashed-dotted line A1-A2 in FIG.1A.

<Structure of Display Device>

The display device 100 described in this embodiment includes a displayarea 131, a driver circuit 132, and a driver circuit 133. In addition,the display device 100 includes a terminal electrode 216 and alight-emitting element 125 including a first electrode 115, an EL layer117, and a second electrode 118. A plurality of light-emitting elements125 are formed in the display area 131. A transistor 232 for controllingthe amount of light emitted from the light-emitting element 125 isconnected to each light-emitting element 125.

The terminal electrode 216 is electrically connected to an externalelectrode 124 through an anisotropic conductive connection layer 123formed in an opening 122. In addition, the terminal electrode 216 iselectrically connected to the driver circuit 132 and the driver circuit133.

The driver circuit 132 and the driver circuit 133 each include aplurality of transistors 252. The driver circuit 132 and the drivercircuit 133 each have a function of determining which of thelight-emitting elements 125 in the display area 131 is supplied with asignal from the external electrode 124.

In the display device 100 illustrated in FIGS. 1A and 1B, a substrate111 and a substrate 121 are attached to each other with a bonding layer120 therebetween. An insulating layer 205 is formed over the substrate111 with a bonding layer 112 therebetween. The insulating layer 205 ispreferably formed as a single layer or a multilayer using any of siliconoxide, silicon nitride, silicon oxynitride, silicon nitride oxide,aluminum oxide, aluminum oxynitride, and aluminum nitride oxide. Theinsulating layer 205 can be formed by a sputtering method, a CVD method,a thermal oxidation method, a coating method, a printing method, or thelike.

An insulating layer 145 is formed on the substrate 121 with a bondinglayer 142 therebetween. A light-blocking layer 264 is formed on thesubstrate 121 with the insulating layer 145 therebetween. In addition, acoloring layer 266 and an overcoat layer 268 are formed on the substrate121 with the insulating layer 145 therebetween.

Note that the insulating layer 205 functions as a base layer and canprevent or reduce diffusion of moisture or impurity elements from thesubstrate 111, the bonding layer 112, or the like to the transistor orthe light-emitting element. Note that the insulating layer 145 functionsas a base layer and can prevent or reduce diffusion of moisture orimpurity elements from the substrate 121, the bonding layer 142, or thelike to the transistor or the light-emitting element. The insulatinglayer 145 can be formed using a material and a method similar to thoseof the insulating layer 205.

An organic resin material, a glass material that is thin enough to haveflexibility, or the like can be used for the substrate 111 and thesubstrate 121. In the case where the display device 100 is what iscalled a bottom-emission display device or a dual-emission displaydevice, a material that transmits light emitted from the EL layer 117 isused for the substrate 111. In the case where the display device 100 isa top-emission display device or a dual-emission display device, amaterial that transmits light emitted from the EL layer 117 is used forthe substrate 121.

Examples of materials that have flexibility and transmit visible light,which can be used for the substrate 111 and the substrate 121, include apolyethylene terephthalate resin, a polyethylene naphthalate resin, apolyacrylonitrile resin, a polyimide resin, a polymethylmethacrylateresin, a polycarbonate resin, a polyethersulfone resin, a polyamideresin, a cycloolefin resin, a polystyrene resin, a polyamide imideresin, a polyvinylchloride resin, or the like. In the case where lightdoes not have to be transmitted, a non-light-transmitting substrate maybe used. The substrate 121 or the substrate 111 may be, for example, astainless steel substrate or a stainless steel foil substrate.

The thermal expansion coefficients of the substrate 111 and thesubstrate 121 are preferably less than or equal to 30 ppm/K, morepreferably less than or equal to 10 ppm/K. In addition, on surfaces ofthe substrate 111 and the substrate 121, a protective film having lowwater permeability may be formed in advance; examples of the protectivefilm include a film containing nitrogen and silicon such as a siliconnitride film or a silicon oxynitride film and a film containing nitrogenand aluminum such as an aluminum nitride film. Note that a structure inwhich a fibrous body is impregnated with an organic resin (also calledprepreg) may be used as the substrate 111 and the substrate 121.

With such substrates, a non-breakable display device can be provided.Alternatively, a lightweight display device can be provided.Alternatively, an easily bendable display device can be provided.

In addition, the transistor 232, the transistor 252, the terminalelectrode 216, and a wiring 219 are formed over the insulating layer205. Note that although a channel-etched transistor that is a type ofbottom-gate transistor is illustrated as the transistor 232 and thetransistor 252 in this embodiment, a channel-protective transistor, atop-gate transistor, or the like can also be used. It is also possibleto use a dual-gate transistor, in which a semiconductor layer in which achannel is formed is interposed between two gate electrodes.

The transistor 232 and the transistor 252 may have the same structure.However, the size (e.g., channel length and channel width) or the likeof each transistor can be adjusted as appropriate.

The transistor 232 and the transistor 252 each include a gate electrode206, a gate insulating layer 207, a semiconductor layer 208, a sourceelectrode 209 a, and a drain electrode 209 b.

The electrode 216, the wiring 219, the gate electrode 206, the sourceelectrode 209 a, and the drain electrode 209 b can be formed using amaterial and a method similar to those of the terminal electrode 216described later. In addition, the gate insulating layer 207 can beformed using a material and a method similar to those of the insulatinglayer 205.

The semiconductor layer 208 can be formed using an amorphoussemiconductor, a microcrystalline semiconductor, a polycrystallinesemiconductor, or the like. For example, amorphous silicon ormicrocrystalline germanium can be used. Alternatively, a compoundsemiconductor such as silicon carbide, gallium arsenide, an oxidesemiconductor, or a nitride semiconductor, an organic semiconductor, orthe like can be used.

In the case of using an organic semiconductor for the semiconductorlayer 208, a low molecular organic material having an aromatic ring, an-electron conjugated conductive polymer, or the like can be used. Forexample, rubrene, tetracene, pentacene, perylenediimide,tetracyanoquinodimethane, polythiophene, polyacetylene, orpolyparaphenylene vinylene can be used.

In the case of using an oxide semiconductor for the semiconductor layer208, a c-axis aligned crystalline oxide semiconductor (CAAC-OS), apolycrystalline oxide semiconductor, a microcrystalline oxidesemiconductor, a nanocrystalline oxide semiconductor (nc-OS), anamorphous oxide semiconductor, or the like can be used.

Note that an oxide semiconductor has an energy gap as wide as 3.0 eV ormore and high visible-light transmissivity. In a transistor obtained byprocessing an oxide semiconductor under appropriate conditions, theoff-state current at ambient temperature (e.g., 25° C.) can be less thanor equal to 100 zA (1×10⁻¹⁹ A), less than or equal to 10 zA (1×10⁻²⁰ A),and further less than or equal to 1 zA (1×10⁻²¹ A). Thus, a displaydevice with low power consumption can be provided.

In the case of using an oxide semiconductor for the semiconductor layer208, an insulating layer containing oxygen is preferably used as aninsulating layer that is in contact with the semiconductor layer 208.

In addition, an insulating layer 210 is formed over the transistor 232and the transistor 252, and an insulating layer 211 is formed over theinsulating layer 210. The insulating layer 210 functions as a protectiveinsulating layer and can prevent or reduce diffusion of impurityelements from a layer above the insulating layer 210 to the transistor232 and the transistor 252. The insulating layer 210 can be formed usinga material and a method similar to those of the insulating layer 205.

Planarization treatment may be performed on the insulating layer 211 toreduce unevenness of a surface on which the light-emitting element 125is formed. The planarization treatment may be, but not particularlylimited to, polishing treatment (e.g., chemical mechanical polishing(CMP)) or dry etching treatment.

Forming the insulating layer 211 using an insulating material with aplanarization function can make polishing treatment unnecessary. As theinsulating material with a planarization function, for example, anorganic material such as a polyimide resin or an acrylic resin can beused. Other than such organic materials, it is also possible to use alow-dielectric constant material (a low-k material) or the like. Notethat the insulating layer 211 may be formed by stacking a plurality ofinsulating layers formed using any of these materials.

In addition, over the insulating layer 211, the light-emitting element125 and the partition 114 for separating the adjacent light-emittingelements 125 are formed.

The display device 100 is what is called a top-emission display device,in which light 235 emitted from the light-emitting element 125 isextracted from the substrate 121 side through the coloring layer 266.

The light-emitting element 125 is electrically connected to thetransistor 232 through openings formed in the insulating layer 211 andthe insulating layer 210.

The substrate 121 is formed to face the substrate 111 and may thus becalled a “counter substrate”.

Note that as illustrated in FIG. 15A, a touch sensor may be providedover the substrate 121. Providing the touch sensor directly over thesubstrate 121 as described above can reduce displacement of the touchsensor when the display device is bent. The touch sensor is formed usinga conductive layer 991, a conductive layer 992, and the like. Inaddition, an insulating layer 993 is formed between the conductivelayers.

As the conductive layer 991 and/or the conductive layer 992, atransparent conductive film of indium tin oxide, indium zinc oxide, orthe like is preferably used. Note that a layer containing alow-resistance material may be used for part or the whole of theconductive layer 991 and/or the conductive layer 992 in order to reduceresistance. For example, the conductive layer 991 and/or the conductivelayer 992 can be formed as a single layer or a stack using any of metalssuch as aluminum, titanium, chromium, nickel, copper, yttrium,zirconium, molybdenum, silver, tantalum, and tungsten and an alloycontaining any of these metals as a main component. Alternatively, ametal nanowire may be used as the conductive layer 991 and/or theconductive layer 992. Silver or the like is preferably used as a metalfor the metal nanowire, in which case the resistance value can bereduced and the sensitivity of the sensor can be improved.

The insulating layer 993 is preferably formed as a single layer or amultilayer using silicon oxide, silicon nitride, silicon oxynitride,silicon nitride oxide, aluminum oxide, aluminum oxynitride, aluminumnitride oxide, or the like. The insulating layer 993 can be formed by asputtering method, a CVD method, a thermal oxidation method, a coatingmethod, a printing method, or the like.

Note that the touch sensor may be formed using a substrate other thanthe substrate 121. FIG. 16A illustrates an example of the case where atouch sensor is formed using a substrate 994. Although the touch sensoris provided over the substrate 994, one embodiment of the presentinvention is not limited thereto. The touch sensor may be provided underthe substrate 994 (i.e., between the substrate 121 and the substrate994). In that case, the substrate 994 may be formed of tempered glass sothat the display device can be protected from damage or the like.

Note that the coloring layer 266, the light-blocking layer 264, theovercoat layer 268, and the like are not necessarily provided. In thatcase, color display can be performed with the use of an EL layer 117A,an EL layer 117B, and the like. The EL layer 117A, the EL layer 117B,and the like can emit light of the respective colors such as red, blue,and green. The non-use of the coloring layer 266 can improve the colorpurity and reduce the amount of light loss. FIG. 15B illustrates anexample of the case where the coloring layer 266 and the like in FIG.15A are not used, and FIG. 16B illustrates an example of the case wherethe coloring layer 266 and the like in FIG. 16A are not used.

<Example of Configuration of Pixel Circuit>

Here, a specific example of a configuration of the display device 100 isdescribed with reference to FIGS. 2A to 2C. FIG. 2A is a block diagramillustrating the configuration of the display device 100. The displaydevice 100 includes the display area 131, the driver circuit 132, andthe driver circuit 133. The driver circuit 132 functions as, forexample, a scan line driver circuit, and the driver circuit 133functions as, for example, a signal line driver circuit.

The display device 100 includes m scan lines 135 which are arranged inparallel or substantially in parallel to each other and whose potentialsare controlled by the driver circuit 132, and n signal lines 136 whichare arranged in parallel or substantially in parallel to each other andwhose potentials are controlled by the driver circuit 133. The displayarea 131 includes a plurality of pixels 134 arranged in a matrix. Thedriver circuit 132 and the driver circuit 133 may be collectivelyreferred to as a driver circuit portion.

Each of the scan lines 135 is electrically connected to the n pixels 134in the corresponding row among the pixels 134 arranged in m rows and ncolumns in the display area 131. Each of the signal lines 136 iselectrically connected to the m pixels 134 in the corresponding columnamong the pixels 134 arranged in m rows and n columns. Note that m and nare each an integer of 1 or more.

FIGS. 2B and 2C illustrate circuit configurations that can be used forthe pixels 134 in the display device illustrated in FIG. 2A.

[Example of Pixel Circuit for Light-Emitting Display Device]

The pixel 134 illustrated in FIG. 2B includes a transistor 431, thecapacitor 233, the transistor 232, and the light-emitting element 125.

One of a source electrode and a drain electrode of the transistor 431 iselectrically connected to a wiring to which a data signal is supplied(hereinafter referred to as a signal line DL_n). A gate electrode of thetransistor 431 is electrically connected to a wiring to which a gatesignal is supplied (hereinafter referred to as a scan line GL_m).

The transistor 431 has a function of controlling whether to write a datasignal to a node 435 by being turned on or off.

One of a pair of electrodes of the capacitor 233 is electricallyconnected to the node 435, and the other is electrically connected to anode 437. The other of the source electrode and the drain electrode ofthe transistor 431 is electrically connected to the node 435.

The capacitor 233 functions as a storage capacitor for storing datawritten to the node 435.

One of a source electrode and a drain electrode of the transistor 232 iselectrically connected to the potential supply line VL_a, and the otheris electrically connected to the node 437. A gate electrode of thetransistor 232 is electrically connected to the node 435.

One of an anode and a cathode of the light-emitting element 125 iselectrically connected to a potential supply line VL_b, and the other iselectrically connected to the node 437.

As the light-emitting element 125, an organic electroluminescent element(also referred to as an organic EL element) or the like can be used, forexample. Note that the light-emitting element 125 is not limited theretoand may be an inorganic EL element containing an inorganic material.

Note that a high power supply potential VDD is supplied to one of thepotential supply line VL_a and the potential supply line VL_b, and a lowpower supply potential VSS is supplied to the other.

In the display device including the pixel 134 in FIG. 2B, the pixels 134are sequentially selected row by row by the first driver circuit 132,whereby the transistors 431 are turned on and a data signal is writtento the nodes 435

When the transistors 431 are turned off, the pixels 134 in which thedata has been written to the nodes 435 are brought into a holding state.The amount of current flowing between the source electrode and the drainelectrode of the transistor 232 is controlled in accordance with thepotential of the data written to the node 435. The light-emittingelement 125 emits light with a luminance corresponding to the amount offlowing current. This operation is sequentially performed row by row;thus, an image is displayed.

[Example of Pixel Circuit for Liquid Crystal Display Device]

The pixel 134 illustrated in FIG. 2C includes a liquid crystal element432, the transistor 431, and the capacitor 233.

The potential of one of a pair of electrodes of the liquid crystalelement 432 is set according to the specifications of the pixels 134 asappropriate. The alignment state of the liquid crystal element 432depends on data written to a node 436. A common potential may be appliedto one of the pair of electrodes of the liquid crystal element 432included in each of the plurality of pixels 134. The potential suppliedto one of a pair of electrodes of the liquid crystal element 432 in thepixel 134 in one row may be different from the potential supplied to oneof a pair of electrodes of the liquid crystal element 432 in the pixel134 in another row.

Examples of a driving method of the display device including the liquidcrystal element 432 include a TN mode, an STN mode, a VA mode, anaxially symmetric aligned micro-cell (ASM) mode, an opticallycompensated birefringence (OCB) mode, a ferroelectric liquid crystal(FLC) mode, an antiferroelectric liquid crystal (AFLC) mode, an MVAmode, a patterned vertical alignment (PVA) mode, an IPS mode, an FFSmode, and a transverse bend alignment (TBA) mode. Other examples of thedriving method of the display device include an electrically controlledbirefringence (ECB) mode, a polymer dispersed liquid crystal (PDLC)mode, a polymer network liquid crystal (PNLC) mode, and a guest-hostmode. Note that the present invention is not limited to these examples,and various liquid crystal elements and driving methods can be appliedto the liquid crystal element and the driving method thereof.

The liquid crystal element 432 may be formed using a liquid crystalcomposition including liquid crystal exhibiting a blue phase and achiral material. Liquid crystal exhibiting a blue phase does not needalignment treatment. In addition, the liquid crystal exhibiting a bluephase has a short response time of 1 msec or less and is opticallyisotropic, which makes the viewing angle dependence small.

Note that a display element other than the light-emitting element 125and the liquid crystal element 432 can be used. For example, anelectrophoretic element, an electronic ink, an electrowetting element, amicro electro mechanical system (MEMS), a digital micromirror device(DMD), a digital micro shutter (DMS), MIRASOL (registered trademark), aninterferometric modulator (IMOD) element, or the like can be used as thedisplay element.

In the pixel 134 in the m-th row and the n-th column, one of a sourceelectrode and a drain electrode of the transistor 431 is electricallyconnected to a signal line DL_n, and the other is electrically connectedto the node 436. A gate electrode of the transistor 431 is electricallyconnected to a scan line GL_m. The transistor 431 has a function ofcontrolling whether to write a data signal to the node 436 by beingturned on or off.

One of a pair of electrodes of the capacitor 233 is electricallyconnected to a wiring to which a particular potential is supplied(hereinafter referred to as a capacitor line CL), and the other iselectrically connected to the node 436. The other of the pair ofelectrodes of the liquid crystal element 432 is electrically connectedto the node 436. The potential of the capacitor line CL is set inaccordance with the specifications of the pixel 134 as appropriate. Thecapacitor 233 functions as a storage capacitor for storing data writtento the node 436.

For example, in the display device including the pixel 134 in FIG. 2C,the pixels 134 are sequentially selected row by row by the first drivercircuit 132, whereby the transistors 431 are turned on and a data signalis written to the nodes 436.

When the transistors 431 are turned off, the pixels 134 in which thedata signal has been written to the nodes 436 are brought into a holdingstate. This operation is sequentially performed row by row; thus, animage is displayed.

<Example of how to Bend Display Device>

The display device 100 of one embodiment of the present invention isfabricated using flexible substrates. This enables the display device100 to be curved or bent freely. Thus, the display device 100 can berolled or folded freely. FIG. 3A is a perspective view illustrating astate in which the display device 100 is folded in thirds. FIG. 3B is aperspective view illustrating a state in which the gate-fold displaydevice 100 is folded in halves. FIG. 3C is a perspective viewillustrating a state in which the display device 100 is rolled. Notethat the external electrode 124 is not illustrated in FIGS. 3A to 3C.

As illustrated in FIGS. 3A to 3C, the display device 100 can be foldedfreely, and is thus stored easily and highly portable. It is preferablethat the display device 100 be curved or bent (hereinafter, also simplyreferred to as “bent”) so that the substrate 121 is positioned on theinner side (the valley side) and the substrate 111 is positioned on theouter side (the mountain side). FIGS. 3A to 3C each illustrate anexample in which the display device 100 is bent so that the substrate111 is positioned on the outer side.

In a bend portion of the display device 100, mechanical stress due to abend is applied to the substrate 121 and the substrate 111. As for themechanical stress due to the bend, stress 241 applied to the substratepositioned on the outer side in the bend portion is higher than stress242 on the substrate positioned on the inner side in the bend portion.

Over the substrate 111 of the display device 100 disclosed in thisembodiment, transistors are formed in a matrix and wirings for supplyingsignals to the transistors are formed in a grid pattern. In addition, aplurality of insulating layers are formed. The substrate 111 providedwith the wirings, the insulating layers, and the like has highermechanical strength than the substrate 121.

Thus, when the display device 100 is bent so that the substrate 111 ispositioned on the outer side (the mountain side) in the bend portion,the display device 100 is less likely to be broken even when repeatedlybent and extended. Thus, the display device 100 can have highreliability.

The display device 100 is bendable and is thus less likely to be brokeneven when dropped; therefore, a durable display device can be provided.

Note that in the case of a display device having a top-emissionstructure, light is emitted toward the inside of the bend portion. Thus,an emission surface is positioned inside when the display device isbent. This can protect the emission surface. Light is prevented frombeing emitted when the display device is bent, so that power consumptioncan be reduced.

Meanwhile, in the case of a display device having a bottom-emissionstructure, light is emitted toward the outside of the bend portion. Thisenables display to be seen even when the display device is bent. Lightis prevented from being emitted in a region that cannot be seen becauseof a bend of the display device, so that power consumption can bereduced.

FIGS. 19A and 19B are cross-sectional views each illustrating the casewhere a substrate 994 is provided as a substrate for a touch sensor or aprotective substrate over the substrate 121, that is, the case of atop-emission structure. This placement enables the display device 100 tobe less likely to be broken; thus, the reliability of the display device100 can be improved.

Note that in the case where the substrate 994 is provided as a substratefor a touch sensor or a protective substrate under the substrate 111,that is, in the case of a bottom-emission structure, the substrate 111,the substrate 121, and the substrate 994 in the cross-sectional views ofFIGS. 19A and 19B are replaced by the substrate 994, the substrate 111,and the substrate 121, respectively.

This embodiment can be implemented in an appropriate combination withany of the structures described in the other embodiments.

Embodiment 2

In this embodiment, an example of a method for fabricating a displaydevice 100 is described with reference to FIGS. 4A to 4D, FIGS. 5A to5D, FIGS. 6A and 6B, and FIGS. 7A and 7B. Note that FIGS. 4A to 4D,FIGS. 5A to 5D, FIGS. 6A and 6B, and FIGS. 7A and 7B are cross-sectionalviews taken along the dashed-dotted line A1-A2 in FIG. 1A.

[Formation of Separation Layer]

First, a separation layer 113 is formed over an element formationsubstrate 101 (see FIG. 4A). Note that the element formation substrate101 may be a glass substrate, a quartz substrate, a sapphire substrate,a ceramic substrate, a metal substrate, or the like. Alternatively, aplastic substrate having heat resistance to the processing temperatureof this embodiment may be used.

As the glass substrate, for example, a glass material such asaluminosilicate glass, aluminoborosilicate glass, or barium borosilicateglass is used. Note that when the glass substrate contains a largeamount of barium oxide (BaO), the glass substrate can be heat-resistantand more practical. Alternatively, crystallized glass or the like may beused.

The separation layer 113 can be formed using an element selected fromtungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt,zirconium, ruthenium, rhodium, palladium, osmium, iridium, and silicon;an alloy material containing any of the elements; or a compound materialcontaining any of the elements. The separation layer 113 can also beformed to have a single-layer structure or a stacked-layer structureusing any of the materials. Note that the crystalline structure of theseparation layer 113 may be amorphous, microcrystalline, orpolycrystalline. The separation layer 113 can also be formed using ametal oxide such as aluminum oxide, gallium oxide, zinc oxide, titaniumdioxide, indium oxide, indium tin oxide, indium zinc oxide, or InGaZnO(IGZO).

The separation layer 113 can be formed by a sputtering method, a CVDmethod, a coating method, a printing method, or the like. Note that thecoating method includes a spin coating method, a droplet dischargemethod, and a dispensing method.

In the case where the separation layer 113 has a single-layer structure,the separation layer 113 is preferably formed using tungsten,molybdenum, or a tungsten-molybdenum alloy. Alternatively, theseparation layer 113 is preferably formed using an oxide or oxynitrideof tungsten, an oxide or oxynitride of molybdenum, or an oxide oroxynitride of a tungsten-molybdenum alloy.

In the case where the separation layer 113 has a stacked-layer structureincluding, for example, a layer containing tungsten and a layercontaining an oxide of tungsten, the layer containing an oxide oftungsten may be formed as follows: the layer containing tungsten isformed first and then an oxide insulating layer is formed in contacttherewith, so that the layer containing an oxide of tungsten is formedat the interface between the layer containing tungsten and the oxideinsulating layer. Alternatively, the layer containing an oxide oftungsten may be formed by performing thermal oxidation treatment, oxygenplasma treatment, treatment with a highly oxidizing solution such asozone water, or the like on the surface of the layer containingtungsten.

In this embodiment, the separation layer 113 is formed of tungsten by asputtering method.

[Formation of Insulating Layer]

Next, the insulating layer 205 is formed as a base layer over theseparation layer 113 (see FIG. 4A). The insulating layer 205 ispreferably formed as a single layer or a multilayer using silicon oxide,silicon nitride, silicon oxynitride, silicon nitride oxide, aluminumoxide, aluminum oxynitride, aluminum nitride oxide, or the like. Theinsulating layer 205 may have, for example, a two-layer structure ofsilicon oxide and silicon nitride or a five-layer structure in whichmaterials selected from the above are combined. The insulating layer 205can be formed by a sputtering method, a CVD method, a thermal oxidationmethod, a coating method, a printing method, or the like.

The thickness of the insulating layer 205 may be greater than or equalto 30 nm and less than or equal to 500 nm, preferably greater than orequal to 50 nm and less than or equal to 400 nm.

The insulating layer 205 can prevent or reduce diffusion of impurityelements from the element formation substrate 101, the separation layer113, or the like. Even after the element formation substrate 101 isreplaced by the substrate 111, the insulating layer 205 can prevent orreduce diffusion of impurity elements into the light-emitting element125 from the substrate 111, the bonding layer 112, or the like. In thisembodiment, the insulating layer 205 is formed by stacking a200-nm-thick silicon oxynitride film and a 50-nm-thick silicon nitrideoxide film by a plasma CVD method.

[Formation of Gate Electrode]

Next, a gate electrode 206 is formed over the insulating layer 205 (seeFIG. 4A). The gate electrode 206 may be formed using a metal elementselected from aluminum, chromium, copper, tantalum, titanium,molybdenum, and tungsten; an alloy containing any of these metalelements as a component; an alloy containing any of these metal elementsin combination; or the like. The gate electrode 206 can be formed usinga metal selected from aluminum, chromium, copper, tantalum, titanium,molybdenum, and tungsten; an alloy containing any of these metals as acomponent; an alloy containing any of these metals in combination; orthe like. Alternatively, one or more metal elements selected frommanganese and zirconium may be used. The gate electrode 206 may have asingle-layer structure or a stacked structure of two or more layers. Forexample, a single-layer structure of an aluminum film containingsilicon, a two-layer structure in which an aluminum film is stacked overa titanium film, a two-layer structure in which a titanium film isstacked over a titanium nitride film, a two-layer structure in which atungsten film is stacked over a titanium nitride film, a two-layerstructure in which a tungsten film is stacked over a tantalum nitridefilm or a tungsten nitride film, a two-layer structure in which a copperfilm is stacked over a titanium film, a three-layer structure in which atitanium film, an aluminum film, and a titanium film are stacked in thisorder, and the like can be given. Alternatively, a film, an alloy film,or a nitride film which contains aluminum and one or more elementsselected from titanium, tantalum, tungsten, molybdenum, chromium,neodymium, and scandium may be used.

The gate electrode 206 can be formed using a light-transmittingconductive material such as indium tin oxide, indium oxide containingtungsten oxide, indium zinc oxide containing tungsten oxide, indiumoxide containing titanium oxide, indium tin oxide containing titaniumoxide, indium zinc oxide, or indium tin oxide to which silicon oxide isadded. It is also possible to have a stacked-layer structure formedusing the above light-transmitting conductive material and the abovemetal element.

First, a conductive film to be the gate electrode 206 is stacked overthe insulating layer 205 by a sputtering method, a CVD method, anevaporation method, or the like, and a resist mask is formed over theconductive film by a photolithography process. Next, part of theconductive film to be the gate electrode 206 is etched with the use ofthe resist mask to form the gate electrode 206. At the same time, awiring and another electrode can be formed.

The conductive film may be etched by a dry etching method, a wet etchingmethod, or both a dry etching method and a wet etching method. Note thatin the case where the conductive film is etched by a dry etching method,ashing treatment may be performed before the resist mask is removed,whereby the resist mask can be easily removed with a stripper.

Note that the gate electrode 206 may be formed by an electrolyticplating method, a printing method, an inkjet method, or the like insteadof the above formation method.

The thickness of the gate electrode 206 is greater than or equal to 5 nmand less than or equal to 500 nm, preferably greater than or equal to 10nm and less than or equal to 300 nm, more preferably greater than orequal to 10 nm and less than or equal to 200 nm.

The gate electrode 206 may be formed using a light-blocking conductivematerial, whereby external light can be prevented from reaching thesemiconductor layer 208 from the gate electrode 206 side. As a result, avariation in electrical characteristics of the transistor due to lightirradiation can be suppressed.

[Formation of Gate Insulating Layer]

Next, the gate insulating layer 207 is formed (see FIG. 4A). The gateinsulating layer 207 can be formed to have a single-layer structure or astacked-layer structure using, for example, any of silicon oxide,silicon oxynitride, silicon nitride oxide, silicon nitride, aluminumoxide, a mixture of aluminum oxide and silicon oxide, hafnium oxide,gallium oxide, Ga—Zn-based metal oxide, silicon nitride, and the like.

The gate insulating layer 207 may be formed using a high-k material suchas hafnium silicate (HfSiO_(x)), hafnium silicate to which nitrogen isadded (HfSi_(x)O_(y)NZ), hafnium aluminate to which nitrogen is added(HfAl_(x)O_(y)N_(z)), hafnium oxide, or yttrium oxide, so that gateleakage current of the transistor can be reduced. For example, a stackof silicon oxynitride and hafnium oxide may be used.

The thickness of the gate insulating layer 207 is greater than or equalto 5 nm and less than or equal to 400 nm, preferably greater than orequal to 10 nm and less than or equal to 300 nm, more preferably greaterthan or equal to 50 nm and less than or equal to 250 nm.

The gate insulating layer 207 can be formed by a sputtering method, aCVD method, an evaporation method, or the like.

In the case where a silicon oxide film, a silicon oxynitride film, or asilicon nitride oxide film is formed as the gate insulating layer 207, adeposition gas containing silicon and an oxidizing gas are preferablyused as a source gas. Typical examples of the deposition gas containingsilicon include silane, disilane, trisilane, and silane fluoride. As theoxidizing gas, oxygen, ozone, dinitrogen monoxide, and nitrogen dioxidecan be given as examples.

The gate insulating layer 207 can have a stacked-layer structure inwhich a nitride insulating layer and an oxide insulating layer arestacked in this order from the gate electrode 206 side. When the nitrideinsulating layer is provided on the gate electrode 206 side, hydrogen,nitrogen, an alkali metal, an alkaline earth metal, or the like can beprevented from moving from the gate electrode 206 side to thesemiconductor layer 208. Note that nitrogen, an alkali metal, analkaline earth metal, or the like generally serves as an impurityelement of a semiconductor. In addition, hydrogen serves as an impurityelement of an oxide semiconductor. Thus, an “impurity” in thisspecification and the like includes hydrogen, nitrogen, an alkali metal,an alkaline earth metal, or the like.

In the case where an oxide semiconductor is used for the semiconductorlayer 208, the density of defect states at the interface between thegate insulating layer 207 and the semiconductor layer 208 can be reducedby providing the oxide insulating layer on the semiconductor layer 208side. Consequently, a transistor whose electrical characteristics arehardly degraded can be obtained. Note that in the case where an oxidesemiconductor is used for the semiconductor layer 208, an oxideinsulating layer containing oxygen in a proportion higher than that inthe stoichiometric composition is preferably formed as the oxideinsulating layer. This is because the density of defect states at theinterface between the gate insulating layer 207 and the semiconductorlayer 208 can be further reduced.

In the case where the gate insulating layer 207 is the stack of thenitride insulating layer and the oxide insulating layer as describedabove, the nitride insulating layer is preferably thicker than the oxideinsulating layer.

The nitride insulating layer has a dielectric constant higher than thatof the oxide insulating layer, thus, an electric field generated fromthe gate electrode 206 can be efficiently transmitted to thesemiconductor layer 208 even when the gate insulating layer 207 has alarge thickness. When the gate insulating layer 207 has a large totalthickness, the withstand voltage of the gate insulating layer 207 can beincreased. Accordingly, the reliability of the display device can beimproved.

The gate insulating layer 207 can have a stacked-layer structure inwhich a first nitride insulating layer with few defects, a secondnitride insulating layer with a high blocking property against hydrogen,and an oxide insulating layer are stacked in this order from the gateelectrode 206 side. When the first nitride insulating layer with fewdefects is used in the gate insulating layer 207, the withstand voltageof the gate insulating layer 207 can be improved. In addition, when thesecond nitride insulating layer with a high blocking property againsthydrogen is used in the gate insulating layer 207, hydrogen contained inthe gate electrode 206 and the first nitride insulating layer can beprevented from moving to the semiconductor layer 208.

An example of a method for forming the first and second nitrideinsulating layers is described below. First, a silicon nitride film withfew defects is formed as the first nitride insulating layer by a plasmaCVD method in which a mixed gas of silane, nitrogen, and ammonia is usedas a source gas. Next, a silicon nitride film in which the hydrogenconcentration is low and hydrogen can be blocked is formed as the secondnitride insulating layer by switching the source gas to a mixed gas ofsilane and nitrogen. By such a formation method, the gate insulatinglayer 207 in which nitride insulating layers with few defects and ablocking property against hydrogen are stacked can be formed.

The gate insulating layer 207 can have a stacked-layer structure inwhich a third nitride insulating film with a high blocking propertyagainst impurities, the first nitride insulating layer with few defects,the second nitride insulating layer with a high blocking propertyagainst hydrogen, and the oxide insulating layer are stacked in thisorder from the gate electrode 206 side. When the third nitrideinsulating layer with a high blocking property against impurities isprovided in the gate insulating layer 207, hydrogen, nitrogen, an alkalimetal, an alkaline earth metal, or the like can be prevented from movingfrom the gate electrode 206 to the semiconductor layer 208.

An example of a method for forming the first to third nitride insulatinglayers is described below. First, a silicon nitride film with a highblocking property against an impurity is formed as the third nitrideinsulating layer by a plasma CVD method in which a mixed gas of silane,nitrogen, and ammonia is used as a source gas. Next, a silicon nitridefilm with few defects is formed as the first nitride insulating layer byincreasing the flow rate of ammonia. Next, a silicon nitride film inwhich the hydrogen concentration is low and hydrogen can be blocked isformed as the second nitride insulating layer by switching the sourcegas to a mixed gas of silane and nitrogen. By such a formation method,the gate insulating layer 207 in which nitride insulating layers withfew defects and a blocking property against an impurity are stacked canbe formed.

Moreover, in the case of forming a gallium oxide film as the gateinsulating layer 207, a metal organic chemical vapor deposition (MOCVD)method can be employed.

Note that the threshold voltage of a transistor can be changed bystacking the semiconductor layer 208 in which a channel of thetransistor is formed and an insulating layer containing hafnium oxidewith an oxide insulating layer therebetween and injecting electrons intothe insulating layer containing hafnium oxide.

[Formation of Semiconductor Layer]

As described above, the semiconductor layer 208 can be formed using anamorphous semiconductor, a microcrystalline semiconductor, apolycrystalline semiconductor, or the like. For example, amorphoussilicon or microcrystalline germanium can be used. Alternatively, acompound semiconductor such as silicon carbide, gallium arsenide, anoxide semiconductor, or a nitride semiconductor, an organicsemiconductor, or the like can be used.

The thickness of the semiconductor layer 208 is greater than or equal to3 nm and less than or equal to 200 nm, preferably greater than or equalto 3 nm and less than or equal to 100 nm, more preferably greater thanor equal to 3 nm and less than or equal to 50 nm. In this embodiment, asthe semiconductor layer 208, an oxide semiconductor film with athickness of 30 nm is formed by a sputtering method.

Next, a resist mask is formed over the oxide semiconductor film, andpart of the oxide semiconductor film is selectively etched using theresist mask to form the semiconductor layer 208. The resist mask can beformed by a photolithography method, a printing method, an inkjetmethod, or the like as appropriate. Formation of the resist mask by aninkjet method needs no photomask; thus, fabrication cost can be reduced.

Note that the etching of the oxide semiconductor film may be performedby either one or both of a dry etching method and a wet etching method.After the etching of the oxide semiconductor film, the resist mask isremoved (see FIG. 4B).

[Formation of Source Electrode, Drain Electrode, and the Like]

Next, the source electrode 209 a, the drain electrode 209 b, the wiring219, and the terminal electrode 216 are formed. First, a conductive filmis formed over the gate insulating layer 207 and the semiconductor layer208.

The conductive film can have a single-layer structure or a stacked-layerstructure containing any of metals such as aluminum, titanium, chromium,nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, andtungsten or an alloy containing any of these metals as its maincomponent. For example, the following structures can be given: asingle-layer structure of an aluminum film containing silicon, atwo-layer structure in which an aluminum film is stacked over a titaniumfilm, a two-layer structure in which an aluminum film is stacked over atungsten film, a two-layer structure in which a copper film is stackedover a copper-magnesium-aluminum alloy film, a two-layer structure inwhich a copper film is stacked over a titanium film, a two-layerstructure in which a copper film is stacked over a tungsten film, athree-layer structure in which a titanium film or a titanium nitridefilm, an aluminum film or a copper film, and a titanium film or atitanium nitride film are stacked in this order, a three-layer structurein which a molybdenum film or a molybdenum nitride film, an aluminumfilm or a copper film, and a molybdenum film or a molybdenum nitridefilm are stacked in this order, and a three-layer structure in which atungsten film, a copper film, and a tungsten film are stacked in thisorder.

Note that a conductive material containing oxygen such as indium tinoxide, zinc oxide, indium oxide containing tungsten oxide, indium zincoxide containing tungsten oxide, indium oxide containing titanium oxide,indium tin oxide containing titanium oxide, indium zinc oxide, or indiumtin oxide to which silicon oxide is added, or a conductive materialcontaining nitrogen such as titanium nitride or tantalum nitride may beused. It is also possible to use a stacked-layer structure formed usinga material containing the above metal element and conductive materialcontaining oxygen. It is also possible to use a stacked-layer structureformed using a material containing the above metal element andconductive material containing nitrogen. It is also possible to use astacked-layer structure formed using a material containing the abovemetal element, conductive material containing oxygen, and conductivematerial containing nitrogen.

The thickness of the conductive film is greater than or equal to 5 nmand less than or equal to 500 nm, preferably greater than or equal to 10nm and less than or equal to 300 nm, more preferably greater than orequal to 10 nm and less than or equal to 200 nm. In this embodiment, a300-nm-thick tungsten film is formed as the conductive film.

Then, part of the conductive film is selectively etched using a resistmask to form the source electrode 209 a, the drain electrode 209 b, thewiring 219, and the terminal electrode 216 (including other electrodesand wirings formed using the same film). The resist mask can be formedby a photolithography method, a printing method, an inkjet method, orthe like as appropriate. Formation of the resist mask by an inkjetmethod needs no photomask; thus, fabrication cost can be reduced.

The conductive film may be etched by a dry etching method, a wet etchingmethod, or both a dry etching method and a wet etching method. Note thatan exposed portion of the semiconductor layer 208 may be removed by theetching step in some cases.

The conductive film may be etched by a dry etching method, a wet etchingmethod, or both a dry etching method and a wet etching method. After theetching of the conductive film, the resist mask is removed (see FIG.4C).

[Formation of Insulating Layer]

Next, the insulating layer 210 is formed over the source electrode 209a, the drain electrode 209 b, the wiring 219, and the terminal electrode216. The insulating layer 210 can be formed using a material and amethod similar to those of the insulating layer 205.

In the case where an oxide semiconductor is used for the semiconductorlayer 208, an insulating layer containing oxygen is preferably used forat least part of the insulating layer 210 that is in contact with thesemiconductor layer 208. For example, in the case where the insulatinglayer 210 is a stack of a plurality of layers, at least a layer that isin contact with the semiconductor layer 208 is preferably formed usingsilicon oxide.

[Formation of Opening]

Next, part of the insulating layer 210 is selectively etched using aresist mask to form an opening 128. At the same time, another openingthat is not illustrated is also formed. The resist mask can be formed bya photolithography method, a printing method, an inkjet method, or thelike as appropriate. Formation of the resist mask by an inkjet methodneeds no photomask; thus, fabrication cost can be reduced.

The conductive film may be etched by a dry etching method, a wet etchingmethod, or both a dry etching method and a wet etching method. Note thatan exposed portion of the semiconductor layer 208 may be removed by theetching step in some cases.

The drain electrode 209 b and the terminal electrode 216 are partlyexposed by the formation of the opening 128. The resist mask is removedafter the formation of the opening 128.

[Formation of Planarization Film]

Next, the insulating layer 211 is formed over the insulating layer 210.The insulating layer 211 can be formed using a material and a methodsimilar to those of the insulating layer 205.

Planarization treatment may be performed on the insulating layer 211 toreduce unevenness of a surface on which the light-emitting element 125is formed. The planarization treatment may be, but not particularlylimited to, polishing treatment (e.g., chemical mechanical polishing(CMP)) or dry etching treatment

Forming the insulating layer 211 using an insulating material with aplanarization function can make polishing treatment unnecessary. As theinsulating material with a planarization function, for example, anorganic material such as a polyimide resin or an acrylic resin can beused. Besides such organic materials, a low-dielectric constant material(a low-k material) or the like can be used. Note that the insulatinglayer 211 may be formed by stacking a plurality of insulating layersformed of any of these materials.

Part of the insulating layer 211 that overlaps the opening 128 isremoved to form an opening 129. At the same time, another opening thatis not illustrated is also formed. In addition, the insulating layer 211in a region to which the external electrode 124 is connected later isremoved. Note that the opening 129 or the like can be formed in such amanner that a resist mask is formed by a photolithography process overthe insulating layer 211 and a region of the insulating layer 211 thatis not covered with the resist mask is etched (see FIG. 5A). A surfaceof the drain electrode 209 b is exposed by the formation of the opening129.

When the insulating layer 211 is formed using a photosensitive material,the opening 129 can be formed without the resist mask. In thisembodiment, a photosensitive polyimide resin is used to form theinsulating layer 211 and the opening 129.

[Formation of Anode]

Next, the electrode 115 is formed over the insulating layer 211 (seeFIG. 5B). The electrode 115 is preferably formed using a conductivematerial that efficiently reflects light emitted from the EL layer 117formed later. Note that the electrode 115 may have a stacked-layerstructure of a plurality of layers without limitation to a single-layerstructure. For example, in the case where the electrode 115 is used asan anode, a layer in contact with the EL layer 117 may be alight-transmitting layer, such as an indium tin oxide layer, having awork function higher than that of the EL layer 117, and a layer havinghigh reflectance (e.g., aluminum, an alloy containing aluminum, orsilver) may be provided in contact with the layer.

Note that although the display device having a top-emission structure isdescribed as an example in this embodiment, a display device having abottom-emission structure or a dual-emission structure may be used.

In the case where the display device 100 has a bottom-emission structureor a dual-emission structure, the electrode 115 is preferably formedusing a light-transmitting conductive material.

The electrode 115 can be formed in such a manner that a conductive filmto be the electrode 115 is formed over the insulating layer 211, aresist mask is formed over the conductive film, and a region of theconductive film that is not covered with the resist mask is etched. Theconductive film can be etched by a dry etching method, a wet etchingmethod, or both a dry etching method and a wet etching method. Theresist mask can be formed by a photolithography method, a printingmethod, an inkjet method, or the like as appropriate. Formation of theresist mask by an inkjet method needs no photomask; thus, fabricationcost can be reduced. The resist mask is removed after the formation ofthe electrode 115.

[Formation of Partition]

Next, the partition 114 is formed (see FIG. 5C). The partition 114 isprovided in order to prevent an unintended electrical short-circuitbetween light-emitting elements 125 in adjacent pixels and unintendedlight emission from the light-emitting element 125. In the case of usinga metal mask for formation of the EL layer 117 described later, thepartition 114 has a function of preventing the contact of the metal maskwith the electrode 115. The partition 114 can be formed of an organicresin material such as an epoxy resin, an acrylic resin, or an imideresin or an inorganic material such as silicon oxide. The partition 114is preferably formed so that its sidewall has a tapered shape or atilted surface with a continuous curvature. The sidewall of thepartition 114 having the above-described shape enables favorablecoverage with the EL layer 117 and the electrode 118 formed later.

[Formation of EL Layer]

A structure of the EL layer 117 is described in Embodiment 4.

[Formation of Cathode]

The electrode 118 is used as a cathode in this embodiment, and thus ispreferably formed using a material that has a low work function and caninject electrons into the EL layer 117 described later. As well as asingle-layer of a metal having a low work function, a stack in which ametal material such as aluminum, a conductive oxide material such asindium tin oxide, or a semiconductor material is formed over aseveral-nanometer-thick buffer layer formed of an alkali metal or analkaline earth metal having a low work function may be used as theelectrode 118.

In the case where light emitted from the EL layer 117 is extractedthrough the electrode 118, the electrode 118 preferably has a propertyof transmitting visible light. The light-emitting element 125 includesthe electrode 115, the EL layer 117, and the electrode 118 (see FIG.5D).

[Formation of Counter Element Formation Substrate]

An element formation substrate 141 provided with the light-blockinglayer 264, the coloring layer 266, the overcoat layer 268, theinsulating layer 145, and a separation layer 143 is formed over theelement formation substrate 101 with the bonding layer 120 therebetween(see FIG. 6A). Note that the element formation substrate 141 is formedto face the element formation substrate 101 and may thus be called a“counter element formation substrate”. A structure of the elementformation substrate 141 (counter element formation substrate) isdescribed later.

The bonding layer 120 is in contact with the electrode 118. The elementformation substrate 141 is fixed by the bonding layer 120. A lightcurable adhesive, a reactive curable adhesive, a thermosetting adhesive,or an anaerobic adhesive can be used as the bonding layer 120. Forexample, an epoxy resin, an acrylic resin, or an imide resin can beused. In a top-emission structure, a drying agent (e.g., zeolite) havinga size less than or equal to the wavelength of light or a filler (e.g.,titanium oxide or zirconium) with a high refractive index is preferablymixed into the bonding layer 120, in which case the efficiency ofextracting light emitted from the EL layer 117 can be improved.

[Separation of Element Formation Substrate from Insulating Layer]

Next, the element formation substrate 101 attached to the insulatinglayer 205 with the separation layer 113 therebetween is separated fromthe insulating layer 205 (see FIG. 6B). As a separation method,mechanical force (a separation process with a human hand or a gripper, aseparation process by rotation of a roller, ultrasonic waves, or thelike) may be used. For example, a cut is made in the separation layer113 with a sharp edged tool, by laser light irradiation, or the like andwater is injected into the cut. Alternatively, the cut is sprayed with amist of water. A portion between the separation layer 113 and theinsulating layer 205 absorbs water through capillarity action, so thatthe element formation substrate 101 can be separated easily from theinsulating layer 205.

[Bonding of Substrate]

Next, the substrate 111 is attached to the insulating layer 205 with thebonding layer 112 therebetween (see FIGS. 7A and 7B). The bonding layer112 can be formed using a material similar to that of the bonding layer120.

[Separation of Counter Element Formation Substrate from InsulatingLayer]

Next, the element formation substrate 141 in indirect contact with theinsulating layer 145 via the separation layer 143 is separated from theinsulating layer 145 (see FIG. 8A). The element formation substrate 141can be separated in a manner similar to that of the above-describedseparation method of the element formation substrate 101.

[Bonding of Substrate]

Next, the substrate 121 is attached to the insulating layer 145 with thebonding layer 142 therebetween (see FIG. 8B). The bonding layer 142 canbe formed using a material similar to that of the bonding layer 120.

[Formation of Opening]

Next, the substrate 121, the bonding layer 142, the insulating layer145, the coloring layer 266, the overcoat layer 268, and the bondinglayer 120 in a region overlapping the terminal electrode 216 and theopening 128 are removed to form the opening 122 (see FIG. 9A). A surfaceof the terminal electrode 216 is partly exposed by the formation of theopening 122.

[Formation of External Electrode]

Next, the anisotropic conductive connection layer 123 is formed in theopening 122, and the external electrode 124 for inputting electric poweror a signal to the display device 100 is formed over the anisotropicconductive connection layer 123 (see FIG. 9B). The terminal electrode216 is electrically connected to the external electrode 124 through theanisotropic conductive connection layer 123. For example, a flexibleprinted circuit (FPC) can be used as the external electrode 124.

The anisotropic conductive connection layer 123 can be formed using anyof known anisotropic conductive films (ACF), anisotropic conductivepastes (ACP), and the like.

The anisotropic conductive connection layer 123 is formed by curing apaste-form or sheet-form material that is obtained by mixing conductiveparticles to a thermosetting resin or a thermosetting, light curableresin. The anisotropic conductive connection layer 123 exhibits ananisotropic conductive property by light irradiation orthermocompression bonding. As the conductive particles used for theanisotropic conductive connection layer 123, for example, particles of aspherical organic resin coated with a thin-film metal such as Au, Ni, orCo can be used.

By electrical connection between the external electrode 124 and theterminal electrode 216 through the anisotropic conductive connectionlayer 123, electric power or signals can be input to the display device100.

[Components Formed Over Counter Element Formation Substrate]

Next, components, such as the light-blocking layer 264, formed over theelement formation substrate 141 are described with reference to FIGS.10A to 10D.

First, the element formation substrate 141 is prepared. The elementformation substrate 141 can be formed using a material similar to thatof the element formation substrate 101. Then, the separation layer 143and the insulating layer 145 are formed over the element formationsubstrate 141 (see FIG. 10A). The separation layer 143 can be formedusing a material and a method similar to those of the separation layer113. The insulating layer 145 can be formed using a material and amethod similar to those of the insulating layer 205.

Next, the light-blocking layer 264 is formed over the insulating layer145 (see FIG. 10B). After that, the coloring layer 266 is formed (seeFIG. 10C).

The light-blocking layer 264 and the coloring layer 266 each are formedin a desired position with any of various materials by a printingmethod, an inkjet method, a photolithography method, or the like.

Next, the overcoat layer 268 is formed over the light-blocking layer 264and the coloring layer 266 (see FIG. 10D).

For the overcoat layer 268, an organic insulating layer of an acrylicresin, an epoxy resin, polyimide, or the like can be used. With theovercoat layer 268, for example, an impurity or the like contained inthe coloring layer 266 can be prevented from diffusing into thelight-emitting element 125 side. Note that the overcoat layer 268 is notnecessarily formed.

A light-transmitting conductive film may be formed as the overcoat layer268. The light-transmitting conductive film is formed as the overcoatlayer 268, so that the light 235 emitted from the light-emitting element125 can be transmitted through the overcoat layer 268 and layersoverlapping the overcoat layer 268, while ionized impurities can beprevented from passing through the overcoat layer 268.

The light-transmitting conductive film can be formed using, for example,indium oxide, indium tin oxide (ITO), indium zinc oxide, zinc oxide, orzinc oxide to which gallium is added. Graphene or a metal film that isthin enough to have a light-transmitting property can also be used.

Through the above-described steps, the components such as thelight-blocking layer 264 can be formed over the element formationsubstrate 141.

This embodiment can be implemented in an appropriate combination withany of the structures described in the other embodiments.

Embodiment 3

A display device 150 having a bottom-emission structure can befabricated by modification of the structure of the display device 100having a top-emission structure.

FIG. 11 illustrates an example of a cross-sectional structure of thedisplay device 150 having a bottom-emission structure. Note that FIG. 11is a cross-sectional view of a portion similar to the portion denoted bythe dashed-dotted line A1-A2 in FIG. 1A that is a perspective view ofthe display device 100. The display device 150 having a bottom-emissionstructure differs from the display device 100 in the position where thelight-blocking layer 264, the coloring layer 266, and the overcoat layer268 are formed. Specifically, in the display device 150, thelight-blocking layer 264, the coloring layer 266, and the overcoat layer268 are formed over the substrate 111.

In the display device 150, the substrate 121 on which the insulatinglayer 145 is directly formed can be attached to the substrate 111 withthe bonding layer 120 therebetween. In other words, the insulating layer145 does not need to be transferred from the element formation substrate141; thus, the element formation substrate 141, the separation layer143, and the bonding layer 142 are not needed. This can improve theproductivity, yield, and the like of the display device. Note that othercomponents of the display device 150 can be formed as in the case of thedisplay device 100.

In the display device 150 having a bottom-emission structure, theelectrode 115 is formed using a light-transmitting conductive material,and the electrode 118 is formed using a conductive material thatefficiently reflects light emitted from the EL layer 117.

In the display device 150, the light 235 emitted from the EL layer 117can be extracted from the substrate 111 side through the coloring layer266.

Note that the display device 150 is an example of a display device inwhich a transistor 272 is used as a transistor included in the drivercircuit 133. Although the transistor 272 can be formed in a mannersimilar to that of the transistor 252, the transistor 272 differs fromthe transistor 252 in that an electrode 263 is formed over theinsulating layer 210 in a region overlapping the semiconductor layer208. The electrode 263 can be formed using a material and a methodsimilar to those of the gate electrode 206.

The electrode 263 can also serve as a gate electrode. In the case whereone of the gate electrode 206 and the electrode 263 is simply referredto as a “gate electrode”, the other may be referred to as a “back gateelectrode”. One of the gate electrode 206 and the electrode 263 may bereferred to as a “first gate electrode”, and the other may be referredto as a “second gate electrode”.

In general, the back gate electrode is formed using a conductive filmand positioned so that the channel formation region of the semiconductorlayer is positioned between the gate electrode and the back gateelectrode. Thus, the back gate electrode can function in a mannersimilar to that of the gate electrode. The potential of the back gateelectrode may be the same as that of the gate electrode or may be a GNDpotential or a predetermined potential. By changing a potential of theback gate electrode, the threshold voltage of the transistor can bechanged.

Furthermore, the gate electrode and the back gate electrode are formedusing conductive films and thus each have a function of preventing anelectric field generated outside the transistor from influencing thesemiconductor layer in which the channel is formed (in particular, afunction of blocking static electricity).

In the case where light is incident on the back gate electrode side,when the back gate electrode is formed using a light-blocking conductivefilm, light can be prevented from entering the semiconductor layer fromthe back gate electrode side. Thus, photodegradation of thesemiconductor layer can be prevented and deterioration in electricalcharacteristics of the transistor, such as a shift of the thresholdvoltage, can be prevented.

By providing the gate electrode 206 and the electrode 263 with thesemiconductor layer 208 therebetween and setting the potentials of thegate electrode 206 and the electrode 263 to be equal, a region of thesemiconductor layer 208 through which carriers flow is enlarged in thefilm thickness direction; thus, the number of transferred carriers isincreased. As a result, the on-state current and the field-effectmobility of the transistor are increased.

The gate electrode 206 and the electrode 263 each have a function ofblocking an external electric field; thus, charges in a layer under thegate electrode 206 and in a layer over the electrode 263 do not affectthe semiconductor layer 208. Thus, there is little change in thethreshold voltage in a stress test (e.g., a negative gate biastemperature (−GBT) stress test in which a negative voltage is applied toa gate or a +GBT stress test in which a positive voltage is applied to agate). In addition, changes in the rising voltages of on-state currentat different drain voltages can be suppressed.

The BT stress test is one kind of accelerated test and can evaluate, ina short time, change in characteristics (i.e., a change over time) oftransistors, which is caused by long-term use. In particular, the amountof change in threshold voltage of the transistor in the BT stress testis an important indicator when examining the reliability of thetransistor. As the amount of change in the threshold voltage in the BTstress test is small, the transistor has higher reliability.

By providing the gate electrode 206 and the electrode 263 and settingthe potentials of the gate electrode 206 and the electrode 263 to be thesame, the amount of change in the threshold voltage is reduced.Accordingly, variation in electrical characteristics among a pluralityof transistors is also reduced.

Note that a back gate electrode may be provided in the transistor 232formed in the display area 131.

Note that as in FIGS. 15A and 15B and FIGS. 16A and 16B, a touch sensormay be provided. FIGS. 17A and 17B and FIGS. 18A and 18B illustrateexamples of such cases.

This embodiment can be implemented in an appropriate combination withany of the structures described in the other embodiments.

Embodiment 4

In this embodiment, structure examples of a light-emitting element thatcan be applied to the light-emitting element 125 are described. Notethat an EL layer 320 described in this embodiment corresponds to the ELlayer 117 described in the above embodiment.

<Structure of Light-Emitting Element>

In a light-emitting element 330 illustrated in FIG. 12A, the EL layer320 is interposed between a pair of electrodes (an electrode 318 and anelectrode 322). Note that the electrode 318 is used as an anode and theelectrode 322 is used as a cathode as an example in the followingdescription of this embodiment.

The EL layer 320 includes at least a light-emitting layer and may have astacked-layer structure including a functional layer other than thelight-emitting layer. As the functional layer other than thelight-emitting layer, a layer containing a substance having a highhole-injection property, a substance having a high hole-transportproperty, a substance having a high electron-transport property, asubstance having a high electron-injection property, a bipolar substance(a substance having high electron- and hole-transport properties), orthe like can be used. Specifically, functional layers such as ahole-injection layer, a hole-transport layer, an electron-transportlayer, and an electron-injection layer can be used in combination asappropriate.

The light-emitting element 330 illustrated in FIG. 12A emits light whencurrent flows because of a potential difference generated between theelectrode 318 and the electrode 322 and holes and electrons arerecombined in the EL layer 320. That is, the light-emitting region isformed in the EL layer 320.

In the present invention, light emitted from the light-emitting element330 is extracted to the outside from the electrode 318 side or theelectrode 322 side. Thus, one of the electrode 318 and the electrode 322is formed of a light-transmitting substance.

Note that a plurality of EL layers 320 may be stacked between theelectrode 318 and the electrode 322 as in a light-emitting element 331illustrated in FIG. 12B. In the case where n (n is a natural number of 2or more) layers are stacked, a charge generation layer 320 a ispreferably provided between an m-th EL layer 320 and an (m+1)-th ELlayer 320. Note that m is a natural number greater than or equal to 1and less than n.

The charge generation layer 320 a can be formed using a compositematerial of an organic compound and a metal oxide, a metal oxide, acomposite material of an organic compound and an alkali metal, analkaline earth metal, or a compound thereof; alternatively, thesematerials can be combined as appropriate. Examples of the compositematerial of an organic compound and a metal oxide include compositematerials of an organic compound and a metal oxide such as vanadiumoxide, molybdenum oxide, and tungsten oxide. As the organic compound, avariety of compounds can be used; for example, low molecular compoundssuch as an aromatic amine compound, a carbazole derivative, and aromatichydrocarbon and oligomers, dendrimers, and polymers of these lowmolecular compounds. As the organic compound, it is preferable to usethe organic compound which has a hole-transport property and has a holemobility of 10⁻⁶ cm²/Vs or higher. However, any substance other than theabove-described materials may also be used as long as the substance hasa higher hole-transport property than an electron-transport property.These materials used for the charge generation layer 320 a haveexcellent carrier-injection properties and carrier-transport properties;thus, the light-emitting element 330 can be driven with low current andwith low voltage.

Note that the charge generation layer 320 a may be formed with acombination of a composite material of the organic compound and themetal oxide with another material. For example, a layer containing acomposite material of the organic compound and the metal oxide may becombined with a layer containing a compound of a substance selected fromsubstances having an electron-donating property and a compound having ahigh electron-transport property. Moreover, a layer containing acomposite material of the organic compound and the metal oxide may becombined with a transparent conductive film.

The light-emitting element 331 having such a structure is unlikely tohave problems such as energy transfer and quenching and has an expandedchoice of materials, and thus can easily have both high emissionefficiency and a long lifetime. Moreover, it is easy to obtainphosphorescence from one light-emitting layer and fluorescence from theother light-emitting layer.

The charge generation layer 320 a has a function of injecting holes toone of the EL layers 320 that is in contact with the charge generationlayer 320 a and a function of injecting electrons to the other EL layer320 that is in contact with the charge generation layer 320 a, whenvoltage is applied between the electrode 318 and the electrode 322.

The light-emitting element 331 illustrated in FIG. 12B can provide avariety of emission colors by changing the type of the light-emittingsubstance used for the EL layer 320. In addition, a plurality oflight-emitting substances emitting light of different colors may be usedas the light-emitting substances, whereby light emission having a broadspectrum or white light emission can be obtained.

In the case of obtaining white light emission using the light-emittingelement 331 illustrated in FIG. 12B, as for the combination of aplurality of EL layers, a structure for emitting white light includingred light, green light, and blue light may be used; for example, thestructure may include a light-emitting layer containing a bluefluorescent substance as a light-emitting substance and a light-emittinglayer containing red and green phosphorescent substances aslight-emitting substances. Alternatively, a structure including alight-emitting layer emitting red light, a light-emitting layer emittinggreen light, and a light-emitting layer emitting blue light may beemployed. Further alternatively, with a structure includinglight-emitting layers emitting light of complementary colors, whitelight emission can be obtained. In a stacked-layer element including twolight-emitting layers in which light emitted from one of thelight-emitting layers and light emitted from the other light-emittinglayer have complementary colors to each other, the combinations ofcolors are as follows: blue and yellow, blue-green and red, and thelike.

Note that in the structure of the above-described stacked-layer element,by providing the charge generation layer between the stackedlight-emitting layers, the element can have a long lifetime in ahigh-luminance region while keeping the current density low. Inaddition, the voltage drop due to the resistance of the electrodematerial can be reduced, whereby uniform light emission in a large areais possible.

This embodiment can be implemented in an appropriate combination withany of the structures described in the other embodiments.

Embodiment 5

In this embodiment, examples of an electronic appliance and a lightingdevice that include the display device of one embodiment of the presentinvention are described with reference to drawings

As examples of electronic appliances with flexibility, the following canbe given: television devices (also called televisions or televisionreceivers), monitors of computers or the like, digital cameras, digitalvideo cameras, digital photo frames, mobile phones (also called cellularphones or mobile phone devices), portable game machines, portableinformation terminals, audio reproducing devices, and large gamemachines such as pachinko machines.

In addition, a lighting device or a display device can be incorporatedalong a curved inside/outside wall surface of a house or a building or acurved interior/exterior surface of a car.

FIG. 13A illustrates an example of a mobile phone. A mobile phone 7400is provided with a display portion 7402 incorporated in a housing 7401,an operation button 7403, an external connection port 7404, a speaker7405, a microphone 7406, and the like. Note that the mobile phone 7400is manufactured using the display device in the display portion 7402.

When the display portion 7402 of the mobile phone 7400 illustrated inFIG. 13A is touched with a finger or the like, data can be input to themobile phone 7400. In addition, operations such as making a call andinputting text can be performed by touch on the display portion 7402with a finger or the like

The power can be turned on or off with the operation button 7403. Inaddition, types of images displayed on the display portion 7402 can beswitched: for example, switching images from a mail creation screen to amain menu screen is performed with the operation button 7403.

Here, the display portion 7402 includes the display device of oneembodiment of the present invention. Thus, the mobile phone can have acurved display portion and high reliability.

FIG. 13B illustrates an example of a wristband-type display device. Aportable display device 7100 includes a housing 7101, a display portion7102, an operation button 7103, and a sending and receiving device 7104.

The portable display device 7100 can receive a video signal with thesending and receiving device 7104 and can display the received video onthe display portion 7102. In addition, with the sending and receivingdevice 7104, the portable display device 7104 can send an audio signalto another receiving device.

With the operation button 7103, power ON/OFF, switching displayedvideos, adjusting volume, and the like can be performed.

Here, the display portion 7102 includes the display device of oneembodiment of the present invention. Thus, the mobile display device canhave a curved display portion and high reliability.

FIGS. 13C and 13D illustrate examples of lighting devices. Lightingdevices 7200, 7210, and 7220 each include a stage 7201 provided with anoperation switch 7203 and a light-emitting portion supported by thestage 7201.

A light-emitting portion 7212 included in the lighting device 7210illustrated in FIG. 13C has two convex-curved light-emitting portionssymmetrically placed. Thus, light radiates from the lighting device7210.

The lighting device 7220 illustrated in FIG. 13D includes aconcave-curved light-emitting portion 7222. This is suitable forilluminating a specific range because light emitted from thelight-emitting portion 7222 is collected to the front of the lightingdevice 7220.

The light-emitting portion included in each of the lighting devices7200, 7210, and 7220 is flexible; thus, the light-emitting portion maybe fixed on a plastic member, a movable frame, or the like so that anemission surface of the light-emitting portion can be bent freelydepending on the intended use.

The light-emitting portions included in the lighting devices 7200, 7210,and 7220 each include the display device of one embodiment of thepresent invention. Thus, the lighting devices can have curved displayportions and high reliability.

FIG. 14A illustrates an example of a portable display device. A displaydevice 7300 includes a housing 7301, a display portion 7302, operationbuttons 7303, a display portion pull 7304, and a control portion 7305.

The display device 7300 includes a rolled flexible display portion 7302in the cylindrical housing 7301. The display portion 7302 includes afirst substrate provided with a light-blocking layer and the like and asecond substrate provided with a transistor and the like. The displayportion 7302 is rolled so that the second substrate is positionedagainst an inner wall of the housing 7301.

The display device 7300 can receive a video signal with the controlportion 7305 and can display the received video on the display portion7302. In addition, a battery is included in the control portion 7305.Moreover, a connector may be included in the control portion 7305 sothat a video signal or power can be supplied directly.

With the operation buttons 7303, power ON/OFF, switching of displayedvideos, and the like can be performed.

FIG. 14B illustrates a state in which the display portion 7302 is pulledout with the display portion pull 7304. Videos can be displayed on thedisplay portion 7302 in this state. In addition, the operation buttons7303 on the surface of the housing 7301 allow one-handed operation

Note that a reinforcement frame may be provided for an edge portion ofthe display portion 7302 in order to prevent the display portion 7302from being curved when pulled out.

Note that in addition to this structure, a speaker may be provided forthe housing so that sound is output with an audio signal receivedtogether with a video signal.

The display portion 7302 includes the display device of one embodimentof the present invention. Thus, the display portion 7302 is a flexible,highly reliable display device, which makes the display device 7300lightweight and highly reliable.

It is needless to say that one embodiment of the present invention isnot limited to the above-described electronic devices and lightingdevices as long as the display device of one embodiment of the presentinvention is included.

The structures, methods, and the like described in this embodiment canbe used as appropriate in combination with any of the structures,methods, and the like described in other embodiments.

This application is based on Japanese Patent Application serial no.2013-155990 filed with the Japan Patent Office on Jul. 26, 2013, theentire contents of which are hereby incorporated by reference.

What is claimed is:
 1. An electronic appliance comprising: a firstsubstrate; a second substrate below the first substrate: a firsttransistor, a second transistor, and a light-emitting element, each onthe second substrate, between the first substrate and the secondsubstrate; a display area comprising the first transistor and thelight-emitting element, the display area including a first portion and asecond portion; a driver circuit comprising the second transistor; aflexible printed circuit electrically connected to the driver circuit; atouch sensor overlapping with the display area; and a third bondinglayer between the first substrate and the second substrate, wherein thethird bonding layer comprises an adhesive material, wherein the firstsubstrate and the second substrate are flexible, wherein the electronicappliance is provided with a bent portion configured to display an imageso that the second substrate is positioned on an outer side and thefirst substrate on an inner side in the bent portion, and wherein theelectronic appliance is configured to bend at the bent portion so thatthe first portion and the second portion are arranged substantiallyparallel to each other.
 2. The electronic appliance according to claim1, wherein the electronic appliance is configured to be folded inthirds.
 3. The electronic appliance according to claim 1, wherein theelectronic appliance is configured to be folded so that a third portionand a fourth portion of the electronic appliance are inserted between afifth portion and a sixth portion of the electronic appliance, the thirdportion, the fourth portion, the fifth portion, and the sixth portionbeing arranged substantially parallel to one another.
 4. The electronicappliance according to claim 1, further comprising: wirings arranged ina grid pattern on the second substrate.
 5. The electronic applianceaccording to claim 1, further comprising: an oxide semiconductor layer,wherein a channel formation region of the first transistor is includedin the oxide semiconductor layer.
 6. The electronic appliance accordingto claim 1, further comprising: a light-blocking layer and a coloringlayer below the first transistor.
 7. The electronic appliance accordingto claim 1, wherein the touch sensor is below the second substrate. 8.The electronic appliance according to claim 1, further comprising: alight-blocking layer and a coloring layer below the first transistor,wherein the touch sensor is in contact with a third substrate, below thesecond substrate.
 9. The electronic appliance according to claim 1,wherein the third bonding layer is also provided between the firstsubstrate and the first transistor and between the first substrate andthe second transistor.
 10. The electronic appliance according to claim1, wherein the flexible printed circuit is provided over the firstsubstrate.
 11. An electronic appliance comprising: a first substrate; afirst insulating layer underneath the first substrate; a light-blockinglayer and a coloring layer each underneath the first substrate with thefirst insulating layer therebetween; a second substrate below the firstsubstrate; a second insulating layer over the second substrate; a firsttransistor and a second transistor, each comprising a semiconductorlayer, a gate electrode, a source electrode, and a drain electrode, onthe second substrate with the second insulating layer therebetween; alight-emitting element over the first transistor, the light-emittingelement including a first electrode, a second electrode, and an EL layerbetween the first electrode and the second electrode, the firstelectrode being electrically connected to the semiconductor layer of thefirst transistor via one of the source electrode and the drain electrodeof the first transistor; a display area comprising the first transistorand the light-emitting element, the display area including a firstportion and a second portion; a driver circuit comprising the secondtransistor; a flexible printed circuit electrically connected to thedriver circuit; a touch sensor overlapping with the display area; afirst bonding layer between the first substrate and the first insulatinglayer; a second bonding layer between the second substrate and thesecond insulating layer; and a third bonding layer between the secondelectrode and the first substrate, wherein each of the first to thethird bonding layers comprises an adhesive material, wherein the firstsubstrate and the second substrate are flexible, wherein the electronicappliance is provided with a bent portion configured to display an imageso that the second substrate is positioned on an outer side and thefirst substrate on an inner side in the bent portion, and wherein theelectronic appliance is configured to bend at the bent portion so thatthe first portion and the second portion are arranged substantiallyparallel to each other.
 12. The electronic appliance according to claim11, further comprising: wirings arranged in a grid pattern on the secondsubstrate.
 13. The electronic appliance according to claim 11, whereinthe first to third bonding layers comprise a same adhesive material. 14.The electronic appliance according to claim 11, wherein the first andthe third bonding layers comprise a same adhesive material.
 15. Theelectronic appliance according to claim 11, wherein the semiconductorlayer of the first transistor is an oxide semiconductor layer.
 16. Theelectronic appliance according to claim 11, wherein the flexible printedcircuit is provided over the first substrate.
 17. An electronicappliance comprising: a first substrate; a first insulating layerunderneath the first substrate; a light-blocking layer and a coloringlayer each underneath the first substrate with the first insulatinglayer therebetween; a second substrate below the first substrate; asecond insulating layer over the second substrate; a first transistorand a second transistor, each comprising a semiconductor layer, a gateelectrode, a source electrode, and a drain electrode, on the secondsubstrate with the second insulating layer therebetween; alight-emitting element over the first transistor, the light-emittingelement including a first electrode, a second electrode, and an EL layerbetween the first electrode and the second electrode, the firstelectrode being electrically connected to the semiconductor layer of thefirst transistor via one of the source electrode and the drain electrodeof the first transistor, a display area comprising the first transistorand the light-emitting element, the display area including a firstportion and a second portion; a driver circuit comprising the secondtransistor, a flexible printed circuit electrically connected to thedriver circuit; a touch sensor overlapping with the display area; afirst bonding layer between the first substrate and the first insulatinglayer, a second bonding layer between the second substrate and thesecond insulating layer; and a third bonding layer between the secondelectrode and the first substrate, wherein each of the first to thethird bonding layers comprises an adhesive material, wherein the firstsubstrate and the second substrate are flexible, wherein the electronicappliance is provided with a bent portion configured to display an imageso that the second substrate is positioned on an outer side and thefirst substrate on an inner side in the bent portion, and wherein theelectronic appliance is configured to bend at the bent portion so thatthe first portion and the second portion are provided to be adjacent toeach other and arranged substantially parallel to each other.
 18. Theelectronic appliance according to claim 17, further comprising: wiringsarranged in a grid pattern on the second substrate.
 19. The electronicappliance according to claim 17, wherein the touch sensor is formed onthe first substrate.
 20. The electronic appliance according to claim 17,further comprising: a fourth substrate on which is formed the touchsensor.
 21. The electronic appliance according to claim 17, wherein thefirst to third bonding layers comprise a same adhesive material.
 22. Theelectronic appliance according to claim 17, wherein the first and thethird bonding layers comprise a same adhesive material.
 23. Theelectronic appliance according to claim 17, wherein the semiconductorlayer of the first transistor is an oxide semiconductor layer.
 24. Theelectronic appliance according to claim 17, wherein the flexible printedcircuit is provided over the first substrate.